On September 25, it was reported by Taiwan media that AMD CEO Su Zifeng and other C-level executives planned to travel to Taiwan from the end of September to the beginning of November to meet TSMC, chip packaging experts and large PC manufacturers.
据台媒报道，9月25日，AMD首席执行官苏子峰和公司其他C级高管计划于9月底至11月初前往台湾，准备会见台积电、芯片包装专家和大型高管PC制造商。
Su Zifeng plans to discuss future cooperation with Wei Zhejia, CEO of TSMC. Taiwan media quoted insiders as saying that the topics discussed included the use of TSMC's "N3 Plus" manufacturing node (possibly N3P) and N2 (2nm level) manufacturing technology. In addition, the CEOs of the two companies will discuss plans for future orders, including technologies that are available or will be available in the near future.
苏子峰计划与台积电首席执行官魏哲家讨论未来的合作。台湾媒体援引知情人士的话说，讨论的主题包括台积电“N3Plus”制造节点(也许是N3P）和N2（2nm级)制造技术的应用。此外，两家公司的首席执行官将讨论未来的订单计划，包括短期内可用或可用的技术。
VOA online learned that TSMC plans to start mass production of chips on N2 nodes sometime in the second half of 2025, so it is time for AMD to talk about the details of using N2 in its products in 2026 and beyond.
VOA在线网得知，台积电计划于2025年下半年某个时候开始在2025年下半年开始N芯片是在2节点上量产的，因此，AMD是时候开始讨论2026年及以后商品的应用了N2的细节了。