Siemens Digital Industries Software, a subsidiary of Siemens, said today that it has launched a new software called Tessent Multi die to match and enhance the testing of advanced packaging.
西门子子公司SiemensDigitalIndustriesSoftware今天他们说，他们推出了一个名字TessentMulti-die新软件，以匹配和增强先进包装的测试阶段。
Siemens said that due to the increase in design size, advanced technology node and use model requirements, and the rising packaging density, IC test complexity is also rising rapidly. Ankur Gupta, business leader of Siemens Tesset, said that Siemens had to cooperate with customers according to specific conditions.
西门子表示，由于设计尺寸的提高，先进的技术节点和使用模型要求，以及包装密度的不断提高，IC测试的复杂性也急剧上升。Tessent业务负责人AnkurGupta西门子不得不根据具体情况与客户合作。
Gupta told Reuters: "What we are doing now is to absorb all this knowledge and automate the solution to make it a universal technology for everyone."
Gupta告知美联社：“我们现在正在做的是吸收所有这些知识，并自动化解决方案，使其成为所有人使用的通用技术。”
He said that the software also makes the testing process of advanced packaging (2.5D and 3D packaging) chips easier.
他说，该软件还允许先进包装(2).5D和3D封装)芯片的测试过程更容易。